STUDY ON THE SHEAR TEST CHARACTERISTIC OF LASER SOLDERING JOINT

Abstract

The purpose of this study is to make the experimental basis for the development of the laser-assisted threedimensional micro-bonding technology. The basis of experiments was carried out on the melting of the solder balls in order to secure the laser soldering process technology. This research was to establish the concept on a solder ball bumping process using a fiber laser. After designing and manufacturing the nozzle to move micro solder balls and the laser focusing head, the solder ball bumping experiments were carried out. The laser soldering conditions are analyzed by using bumping experiments of the solder balls of 300 ㎛. To the development of personal and portable electronics such as mobile phones, laptop computers, IC card electronics, industry is making an effort to meet the needs of smaller and lighter products. As an example, the most densely Mount Solder bumping flip-chip packages are tried to apply the technology of laser soldering lead-free joints due to thermal damage and environmental problems, but have a large number of inputs and outputs. The needs to packaging technologies to interface from the macro/micro to micro/nano required recently. Through this research we aim to promote the sustainable development of the Korean electronic parts industry on laser soldering technology.